Macrotron Announces BGA and CSP Enhanced Capability

Fremont, CA (March 9, 2001) - During the past few months Macrotron has been enhancing its capability to assemble and test printed circuit boards populated with BGA (Ball Grid Array), mBGA (Micro Ball Grid Array), Fine Pitch Packages, and CSP (Chip Scale Package). With the addition of a Philips Topaz-X pick-and-place system and the Nicolet X-Ray Test System, Macrotron has positioned itself as a premier contract manufacturer for state-of-the-art assemblies.

Macrotron has a 16-year history of continually updating its equipment to remain current with the most advanced assembly techniques in support of its customers. According to Gordon Ting, Chief Technical Officer, "Macrotron has the resources to continually invest in the latest equipment to keep pace with our demanding customer base. We increase and maintain our customer base by being responsive to their needs. This is why Macrotron is such a great contract manufacturing partner."

The Philips Topaz-X is part of the GEM Platform pick-and-place series which is a high-accuracy placement machine down to 0.04mm 0.00157 inch). This permits error free positioning for even the most critical packages. The multiple camera system in conjunction with a laser scanner combines to place small 0201 to 100mm (4 inch) square components with high accuracy. The Macrotron unit is equipped to support tape or tray packaged components. The Topaz-X coupled with the Fuji CP-6 chipshooter results in a high-speed high accuracy line supporting the most demanding assembly.

The Nicolet NXR X-Ray System is used for micro-focus, real-time, non-destructive inspection of electronic assemblies for manufacturing defects. The assembly is placed in the unit where the x-ray passes through the object and is displayed on the monitor real-time. This provides the operator with the image of the internal features of the assembly where inspection of the solder joints is observed. The micromanipulator is used to move the assembly to obtain a more detailed view of the object. The addition of this diagnostic tool at Macrotron allows for a complete evaluation of the assembly for manufacturing defects prior to final test. It also enhances reliability by detecting poor solder joints which get repaired prior to test and shipment.

About Macrotron

Macrotron has developed the reputation as a leader in Engineering, Test and Verification services. Conveniently located in Silicon Valley since 1984, ISO 9002 certified, with operations worldwide, Macrotron is known as a dependable source for Electronic Contract Manufacturing and Memory Modules. With new equipment in a new building, Macrotron has increased its capacity and commitment for consignment and turnkey Electronic Contract and Memory Module Manufacturing.

As an example of this commitment, Macrotron provides the highest quality Electronic Assemblies and Testing Verification Services in the industry at competitive prices. This requires the flexibility and capacity to provide the design, layout, manufacturing, cleaning, testing, packaging and quick delivery of any type of Electronic Assembly required by our customers.

For more information, contact Bill Mikelonis of Macrotron at 40939 Encyclopedia Circle, Fremont, CA 94538. Telephone: 510-683-9600, E-mail: bill@macrotronusa.com and on the Internet at http://www.macrotronusa.com