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Engineering Services (Memory Modules)

Macrotron Systems has a multi-talented Engineering team with extensive experience in the design of Memory Modules for in-house assembly and test.

Macrotron has Engineering capabilities in the following area:

  • PCB Design
  • Simulation
  • Verification
  • Gerber file generation
  • Prototype build

 
  • Test
  • Cost optimization
  • Alternate source of selection and qualification
  • Design for manufacturability
  • Built in test capability    

Final Test Capabilities:

  • Functional test for manufacturing defects
  • Motherboard test for compatibilities
  • Lot sample motherboard test using Memory Stress Test 

Marking Capabilities:

  • Demarking Chips and PCBs
  • Thermal Ink labels
  • Laser Mark ICs and PCBs
  • Private Labeling

Packaging Capabilities:

  • Antistatic tray
  • Antistatic bag
  • Customer Provided
  • Door-ship

Macrotron can offer the lowest total cost engagement through:

  • Engineering expertise
  • Efficient manufacturing
  • Flexibility
  • Proven quality
  • Historically reliable

Copyright 2007 Macrotron Systems, Inc. All rights reserved.